- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
Patent holdings for IPC class H01L 25/065
Total number of patents in this class: 14456
10-year publication summary
998
|
1148
|
1249
|
1315
|
1416
|
1454
|
1550
|
1641
|
1816
|
761
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
2383 |
Samsung Electronics Co., Ltd. | 131630 |
1495 |
Intel Corporation | 45621 |
1189 |
Micron Technology, Inc. | 24960 |
842 |
SK Hynix Inc. | 11030 |
357 |
Kioxia Corporation | 9847 |
312 |
Qualcomm Incorporated | 76576 |
252 |
International Business Machines Corporation | 60644 |
248 |
Invensas Corporation | 645 |
235 |
Sandisk Technologies LLC | 5684 |
181 |
Advanced Semiconductor Engineering, Inc. | 1546 |
168 |
Murata Manufacturing Co., Ltd. | 22355 |
148 |
STATS ChipPAC Pte. Lte. | 1516 |
143 |
Yangtze Memory Technologies Co., Ltd. | 1940 |
129 |
Infineon Technologies AG | 8189 |
122 |
Xilinx, Inc. | 4086 |
122 |
Nanya Technology Corporation | 2000 |
117 |
Renesas Electronics Corporation | 6305 |
116 |
Mediatek Inc. | 4584 |
113 |
Sony Semiconductor Solutions Corporation | 8770 |
110 |
Other owners | 5674 |